28 in 1 Phone CPU BGA Chip Removal Repairing Silicon Manganese Alloy Blades Scraping Knife Set
Description
1. Silicon manganese alloy material blades, heat-resistant, cold-resistant, corrosion-resistant and durable
2. For small vinyl chips removal
3. For iPhone 6S power IC and glass IC removal
4. For base band / CPU / WiFi modules removal
5. For CPU upper layer deflation
6. For glass IC removal
7. For A4-A9 CPU and CPU upper layer removal
8. For A8 A9 CPU removal
9. For chips removal, oil scraping and tin scraping
10. Tin scraping and base band scraping in one take
11. Dilated tin scraping knife and CPU scraping in one take
12. Blower gun temperature should be between 340 and 360 Celsius degree, wind speed should be 28-30
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2. For small vinyl chips removal
3. For iPhone 6S power IC and glass IC removal
4. For base band / CPU / WiFi modules removal
5. For CPU upper layer deflation
6. For glass IC removal
7. For A4-A9 CPU and CPU upper layer removal
8. For A8 A9 CPU removal
9. For chips removal, oil scraping and tin scraping
10. Tin scraping and base band scraping in one take
11. Dilated tin scraping knife and CPU scraping in one take
12. Blower gun temperature should be between 340 and 360 Celsius degree, wind speed should be 28-30
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