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MCU Tools

MCU Tools

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  • EMMC153 EMMC169 Flip Shrapnel To SD Interface Test Socket Burning Socket for Data Recovery Mobile Phone Repair EMMC153 EMMC169 Flip Shrapnel To SD Interface Test Socket Burning Socket for Data Recovery Mobile Phone Repair
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    EMMC153 EMMC169 Flip Shrapnel To SD Interface Test Socket Burning Socket for Data Recovery Mobile Phone Repair

    1,039.97NOK
    1. Type: Test block2. Interface type: SD3. Application: Integrated circuit IC4. Test method:A. Select the limit frame that matches the IC, and place the IC flat in the SOCKET according to the directionB. Insert the SD interface into the card reader and...
    1,039.97NOK
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  • EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write Socket EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write Socket
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    EMCP162/168 Flip Shrapnel To USB Test Socket EMCP Programming Socket Mobile Phone Font Read-Write Socket

    1,335.64NOK
    1. Type: test block2. Working frequency: high frequency3. Application: integrated circuit IC4. Interface type: terminal5. Production process: injection molding6. Features: stable testing7. Contact material: beryllium copper shrapnel8. Insulator material:...
    1,335.64NOK
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  • EMCP221 Flip Shrapnel To USB Test Socket Burn Socket EMCP221 Flip Shrapnel To USB Test Socket Burn Socket
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    EMCP221 Flip Shrapnel To USB Test Socket Burn Socket

    1,381.13NOK
    1. Type: Test block2. Working frequency: High frequency3. Application: integrated circuit IC4. Interface type: Terminal5. Production process: Injection molding6. Features: Stable testing7. Contact material: Beryllium copper shrapnel8. Insulator material:...
    1,381.13NOK
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  • QFN32-0.5 Burning Seat Chip Test Seat Flip Shrapnel Double-Layer Board Programming Seat QFN32-0.5 Burning Seat Chip Test Seat Flip Shrapnel Double-Layer Board Programming Seat
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    QFN32-0.5 Burning Seat Chip Test Seat Flip Shrapnel Double-Layer Board Programming Seat

    636.26NOK
    1. Working frequency: high frequency2. Application range: integrated circuit IC3. Production process: injection molding4. Contact material: beryllium copper shrapnel5. Insulator material: PPS PET6. Number of cores: 327. Name: QFN32 flip shrapnel to 152...
    636.26NOK
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  • HW-243 W5500 Ethernet Network Module Hardware TCP / IP 51 / STM32 Single-Chip Program HW-243 W5500 Ethernet Network Module Hardware TCP / IP 51 / STM32 Single-Chip Program
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    HW-243 W5500 Ethernet Network Module Hardware TCP / IP 51 / STM32 Single-Chip Program

    124.52NOK
    1. No need to write Ethernet underlying code to implement TCP/IP protocol stack2. Support sleep mode and wake-up on LAN, internal integrated 32K bytes on-chip buffer for Ethernet packet processing3. Support 10/100MBPS transfer rate4. Support 8...
    124.52NOK
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    124.52NOK
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